Multi-layer Printed Circuit Board 8 Layer PCB Board Built on Tg170 FR-4 With Immersion Gold for Wireless Communication.
1.1 General description
This is a type of 8 layer printed circuit board built on FR-4 Tg170 substrate for the application of Wireless Communication. It's 1.6 mm thick with white silkscreen on green solder mask and immersion gold on pads. The base material is from ITEQ supply 1 up board per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.
1.2 Features and benifits
Industrial standard material with high Tg (175℃ by DSC) and excellent thermal reliability.
High solderability, no stressing of circuit boards and less contamination of PCB surface.
Electrical test and high voltage test
Quick and on-time delivery
Money-saving, Worry-saving and Labor-saving
Free-of-charge PCB prototype test
1.3 Applications
Video Surveillance
Converters
Electrical Converter
Embedded System Applications
1.4 Parameter and data sheet
| Number of Layers | 8 |
| Board Type | Multilayer PCB |
| Board size | 210.72 x 212.42mm=1UP |
| Board Thickness | 1.60 mm +/-0.16 |
| Board Material | FR-4 |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 170℃ |
| |
| PTH Cu thickness | ≥20 um |
| Inner Iayer Cu thicknes | 35 um (1oz) |
| Surface Cu thickness | 35 um (1oz) |
| |
| Solder Mask Type and Model No. | LPSM, PSR-2000GT600D |
| Solder Mask Supplier | TAIYO |
| Solder Mask Colour | Green |
| Number of Solder Masks | 2 |
| Thickness of Solder Mask | 14 um |
| |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| |
| Mininum Trace (mil) | 5.8 mil |
| Minimum Gap(mil) | 5.4 mil |
| |
| Surface Finish | Immersion Gold |
| RoHS Required | Yes |
| Warpage | 0.25% |
| Thermal Shock Test | Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Solderablity Test | Pass, 255±5℃,5 seconds Wetting Area Least 95% |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
| Drill table (mm) | |
| T1 | 0.450 |
| T2 | 0.600 |
| T3 | 0.800 |
| T4 | 0.900 |
| T5 | 0.950 |
| T6 | 1.000 |
| T7 | 1.250 |
| T8 | 1.300 |
| T9 | 1.400 |
| T10 | 1.600 |
| T11 | 1.700 |
| T12 | 2.000 |
| T13 | 2.550 |
| T14 | 3.000 |
| T15 | 3.250 |
| T16 | 3.500 |
1.5 Design For Manufacture (5)
| Serial NO. | Procedure | Item | Manufacturing capability |
| Large volume (S<100 m²) | Middle volume (S<10 m²) | Prototype(S<1m²) |
| 66 | Contour process | Method of contour process | CNC milling, V-CUT, Break-out tap, break-out holes, Punching |
| 67 | Minimum router | 0.8mm |
| 68 | Min.tolerance of contour | ±0.15mm | ±0.13mm | ±0.1mm |
| 69 | Min.distance of milling contour(no copper exposure) | 12mil | 10mil | 8mil |
| 70 | Angle of V-CUT | 20,30,45,60 ±5 degree |
| 71 | Degree of symmetry of V-CUT | ±6mil | ±5mil | ±4mil |
| 72 | Tolerance of residual thickness of V-CUT | ±6mil | ±5mil | ±4mil |
| 73 | Tolerance of Chamfer angle of Gold finger | ±5 degree | ±5 degree | ±5 degree |
| 74 | Tolerance of residual thickness of bevel edge of gold finger | ±5mil | ±5mil | ±5mil |
| 75 | Min radius of inner corner | 0.4mm |
| 76 | Min. distance from edge to V-Cut (no copper exposure) | 18mil (1.6mm Thick, 20 degree V-groove cutter) | 14mil(1.6mm Thick, 20 degree V-groove cutter) | 12mil (1.6mm Thick, 20 degree V-groove cutter) |
| 77 | 20mil (1.6mm Thick, 30 degree V-groove cutter) | 18mil (1.6mm Thick, 30 degree V-groove cutter) | 16mil (1.6mm Thick, 30 degree V-groove cutter) |
| 78 | 24mil (1.6mm Thick, 45 degree V-groove cutter) | 22mil (1.6mm Thick, 45 degree V-groove cutter) | 20mil (1.6mm Thick, 45 degree V-groove cutter) |
| 79 | 30mil (1.6mm Thick, 60 degree V-groove cutter) | 28mil (1.6mm Thick, 60 degree V-groove cutter) | 26mil (1.6mm Thick, 60 degree V-groove cutter) |
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Tg170 FR4 Multi Layer Printed Circuit Board 8 Layer PCB Board Images
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